Photo: Qualcomm
[Via Satellite 01-13-2016] Qualcomm and TDK announced an agreement to form a joint venture to enable delivery of RF Front-End (RFFE) modules and RF filters into fully integrated systems for mobile devices and fast-growing business segments, such as Internet of Things (IoT), drones, robotics, automotive applications and more, under the name RF360 Holdings Singapore. The agreement is subject to receipt of regulatory approvals and other closing conditions and is expected to close by early 2017.
The joint venture will draw upon TDK’s capabilities in micro-acoustic RF filtering, packaging and module integration technologies and Qualcomm’s expertise in advanced wireless technologies to serve customers with RF solutions into fully integrated systems.
In addition to creating RF360 Holdings, Qualcomm and TDK will expand their collaboration around key technology fields, including sensors and wireless charging.
The post Qualcomm and TDK Form Joint Venture to Provide RF Front-End Solutions for Mobile Devices appeared first on Via Satellite.